Optical fiber laser equipment research technology enterprise

中文 Counseling hotline:400-155-6188

Shenzhen Sunrise automatic laser equipment manufacturer

Laser cutting machine equipment

FPC flexible circuit board laser cutting machine

Category:Laser cutting machine equipment

Abstract: FPC flexible circuit board laser cutting special models! High-performance UV laser cold light source is used to collect high-precision CCD image positioning technology. Through the self-developed visual laser control software, FPC, PCB shape cutting, contour cutting, drilling and composite film opening window super finishing processing ar...

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FPC circuit board laser cutting machine



FPC flexible circuit board laser cutting machine

  FPC flexible circuit board laser cutting machine! High-performance UV laser cold light source is used to collect high-precision CCD image positioning technology. Through the self-developed visual laser control software, FPC, PCB shape cutting, contour cutting, drilling and composite film opening window super finishing processing are realized.


FPC circuit board laser cutting machine advantage

1, the conventional cutting machine prone to delamination and burr, molds need to make the production of small batches, time consuming, and expensive high-precision molds, the machine without opening the mold, a molding, significant cost savings for businesses; 
2 Precision two-dimensional workbench and full-closed CNC system ensure high precision in micro-scale while fast cutting; 
3. Position sensor and CCD image positioning technology, automatic positioning, focusing, fast and accurate positioning, saving time and worry, efficiency high.


FPC circuit board laser cutting machine application range

  This machine is suitable for laser precision cutting of FPC, PCB, soft and hard board, FR4, cover film, ITO, silicon wafer, ceramic and other products.

Laser system Main Specifications
Laser light source 355nm UV
power 12-20W
Coaxial video positioning Industrial CCD
Scanning range 50×50mm
Focus spot diameter <20um(UV Laser)
Autofocus system Z-axis auto focus
Focus control accuracy 0.005mm
Main structure configuration of the whole machine
XY work platform AC servo linear motor
Base High precision granite platform
Range of travel 400×400mm (size range is optional)
Platform motion resolution 0.5um
Machine control system Industrial computer
CCD illumination source led
External auxiliary device Vacuum suction blower, dust extraction and exhaust system
Processing performance
Processing size range 400×330mm (other sizes are available)
Minimum line width 20um
Splicing accuracy ±5um
Galvanometer correction accuracy 3um
XY platform positioning accuracy ±5um
XY platform repeatability ±2um
CCD matching accuracy 3μm
Machine machining accuracy ±20μm
Processing plate thickness <1mm (more than please call us)
Environmental conditions
Supply power AC 220V±10%, 50HZ, 1P, 3KVA
Workpiece adsorption fixture Customized according to needs
Document format DXF, GBR
Ambient temperature 15-30° (requires constant temperature for high precision)
environment humidity <50%
equipment weight 1500KG
Host size 1340mm (W) × 1030mm (D) × 1760mm (H)


Note: The company reserves the right to change the above parameters. If you have special requirements for the machine, we can customize it, please call 400-155-6188 to negotiate.

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